Download e-book for iPad: Alloy and Microstructural Design by John K. Tien

By John K. Tien

ISBN-10: 0126908508

ISBN-13: 9780126908503

ISBN-10: 0323150160

ISBN-13: 9780323150163

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Extra resources for Alloy and Microstructural Design

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Schematic yield stress v e r s u s a g i n g time plot s h o w i n g s u p e r p o s i t i o n i n g of s t r e n g t h e n i n g d u e to precipitation a n d substructure. B. Copper Alloys There are three types of Cu-base alloys in use: single phase, microdu­ plex, and precipitation strengthened. Single-Phase Alloys: The single-phase alloys are strengthened by Fig. 18. Light micrographs s h o w i n g e l o n g a t e d grain structure of Al alloy 2024 plate. Fig. 19. Replica fractograph of Al alloy 2219 s h o w i n g tearing around intermetallics w h i c h h a v e failed in a brittle manner.

Spacing, it is possible for the trailing dislocation to lie entirely in the matrix (Fig. 9c). In this case a still greater applied stress and a smaller pair width are required to move the pair. The leading dislocation may either shear the particle or pass it by Orowan looping (Fig. 9d). Experi­ mental observations (Raynor and Silcock, 1970) suggest that at peak strength and in the overaged state, the latter path is followed. Figure 10 shows various configurations for a pair of dislocations as they move through an array of ordered particles in a high-volumefraction alloy.

24. 55 52 Stephen Μ. Copley and James C. Williams lution and second-phase strengthening. Texture strengthening has re­ cently been suggested to be important in these alloys but this has been less completely investigated in commercial alloy compositions. In an attempt to understand the solid solution strengthening of the β matrix in these alloys, binary Ti-V alloys have been investigated (Paton and Williams, 1970). , 1973). In view of these complications, the solid solution strengthening behav­ ior of the β phase is still incompletely understood at present and is still being studied.

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Alloy and Microstructural Design by John K. Tien


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